New Meizu 15 Plus renders suggest ultra narrow bezels on three sides

Meizu launched the M6S last week and all eyes are now on the anniversary phone from the company named Meizu 15 Plus. According to latest leaked renders, the phone is expected to come with narrow bezels on three sides, with the top one being a bit thicker to house the camera and sensors.

The leak also mentions that the new Meizu flagship will have Snapdragon 845 or Exynos 8895 chipset with a price tag of CNY3,599 (around $560).

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Front and back renders of Meizu 15 Plus

A render of the back panel suggests a dual camera setup with a ring of LED flashes and laser AF sensor below, just like the Meizu Pro 6 Plus. One thing that the renders do not reveal is the location of the fingerprint scanner. It might come on the side, as we have already seen on the Meizu M6S, or to be placed under the screen with a sensor from Synaptics, a design that vivo implemented in its upcoming X20 Plus UD.

There are still a lot of unknowns about the anniversary Meizu phone, but we will know more when China’s Spring Festival comes around in February. According to Jack Wong, company founder, the phone will arrive for the holiday and will be on sale in March.

https://www.gsmarena.com/new_meizu_15_plus_renders_suggest_ultra_narrow_bezels_on_three_sides-news-29253.php